Platinum Metal Target Description

Material selection and processing

First, the platinum material is purified to ensure the purity of the material; second, high-temperature smelting and annealing treatment is carried out to improve the material's organizational structure.
Then, the material is made into the desired shape through a compression molding process.
Then, high-temperature sintering densification treatment is carried out to enhance the material's density and mechanical properties.
Then, mechanical processing, including cutting, grinding, and polishing, is carried out to make the product surface smooth and delicate.
Finally, surface cleaning and performance testing are carried out to strictly control product quality and ensure that each product meets high standards.

Characteristics

High purity, excellent film functionality, strong conductivity.
Outstanding high temperature resistance, strong corrosion resistance, and suitable for harsh environments.
Anti-fatigue, wear resistance, good biocompatibility, and long service life.
High sputtering efficiency, good processing flexibility, wide application field.

Application

Platinum Metal Target can be widely used in the electronic information industry (preparation of electrodes or barrier layers in integrated circuits), new energy fields (preparation of catalytic layers in fuel cells), optical coating fields (reflective layers of laser devices or optical sensors), medical industries (surgical instruments, surface modification coatings for artificial joints), scientific research and special fields (aerospace devices, high-temperature corrosion-resistant coatings in the nuclear industry (such as turbine blades, nuclear reactor components)), jewelry and decoration industries (plating of precision jewelry), and other fields.

The key performance requirements of Pt Target

Purity

It is usually required to be above 99.95%, and the semiconductor grade needs to reach 99.999% (5N) to avoid device failure caused by impurities.

Density

The target material must be free of pores and cracks to ensure uniform deposition rate and few film defects during sputtering.

Grain size

The fine-grained structure can reduce the "target poisoning" effect during sputtering and improve the uniformity of the film.

Processing accuracy

The surface flatness of the target material and its compatibility with the sputtering equipment (such as dimensional tolerance and cooling structure) directly affect the stability of the coating process.

Platinum Metal Target Parameter

Material	Pt
Purity	99.95%
Diameter	50mm
Thickness	0.1mm
Density	21.47g/cm³
Surface	Polished, Alkali Cleaning, Chemical Cleaning
Standard	ASTM, GB
Delivery Time	20 days
Certification	ISO 9001