PVD 4N Nickel Sputtering Target
PVD 4N Nickel Sputtering Target Description
PVD 4N Nickel Sputtering Target is a target made of high-purity nickel material for PVD technology, which enables the achievement of thin films with excellent conductivity and particle minimization for electronic devices with high power and high performance requirements. PVD technology mainly includes vacuum evaporation coating, vacuum sputtering coating and ion coating methods, which can form uniform and dense films on the surface of different materials. PVD 4N Nickel Sputtering Target is widely used in semiconductor materials, optoelectronic and display devices, and solar cell manufacturing to improve device performance and stability due to its good processing performance, strong film adhesion, good uniform compactness, strong wear resistance, strong corrosion resistance, good high temperature stability, low cost, and excellent magnetic response characteristics.
PVD 4N Nickel Sputtering Target Specifications:
|
Purity |
99.99(4N) |
|
Technique |
Hot isostatic pressing,Sintering,Forging,Annealing |
|
Size |
Φ101.6-3.175mm |
|
Thickness |
1mm to 10mm |
|
Diameter |
10mm to 360mm |
|
Density |
8.9g/cm3 |
|
Shape |
Disc |
|
Surface |
Polishing,Alkali Cleaning,Grinding,Black Oxide, etc. |
|
Standards: |
ASTM B865,GB |
|
Certification |
ISO9001:2008 |
PVD 4N Nickel Sputtering Target Pictures:


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