Boron Round Sputter Target
Boron Round Sputter Target Description
Boron Round Sputter Target is a material used for film preparation. It is made of boride materials through powder metallurgy (pressing metal powder under high temperature and high pressure) or vacuum arc melting (melting it by arc heating in a vacuum chamber). Then solidified on the target), it has excellent properties such as high processing performance, high thermal stability, high density, good corrosion resistance, high mechanical strength, high coating quality, wear resistance, and long service life. Boron Round Sputter Target is mainly used to prepare various functional films, such as hard coatings, magnetic films, optical films, anti-reflective films, etc., for sputtering on electronic equipment, semiconductor chips, solar cells, optical devices and other high-end decorations Supplies etc. If necessary, please feel free to contact us by email.
Boron Round Sputter Target Specifications:
|
Material |
Boron(B) |
|
Technique |
Hot isostatic pressing,Grain refinement,Sintering,Forging,Annealing |
|
Purity |
99.5%,99.9%, 99.99% |
|
Diameter |
≤480mm |
|
Thickness |
≥ 1mm |
|
Density |
2.34g/cm3 |
|
Melting Point |
2300 °C |
|
Shape |
Discs, Plates, Column Targets, Step Targets, Custom-made |
|
Surface |
Polished,Alkali Cleaning,Grinding,Black Oxide, etc. |
|
Certification |
ISO9001 |
Boron Round Sputter Target Pictures:


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