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Boron Round Sputter Target
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Boron Round Sputter Target

Boron Round Sputter Target

Boron Round Sputter Target Description Boron Round Sputter Target is a material used for film preparation. It is made of boride materials through powder metallurgy (pressing metal powder under high temperature and high pressure) or vacuum arc melting (melting it by arc heating in a vacuum...
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Product Details ofBoron Round Sputter Target

Boron Round Sputter Target Description

Boron Round Sputter Target is a material used for film preparation. It is made of boride materials through powder metallurgy (pressing metal powder under high temperature and high pressure) or vacuum arc melting (melting it by arc heating in a vacuum chamber). Then solidified on the target), it has excellent properties such as high processing performance, high thermal stability, high density, good corrosion resistance, high mechanical strength, high coating quality, wear resistance, and long service life. Boron Round Sputter Target is mainly used to prepare various functional films, such as hard coatings, magnetic films, optical films, anti-reflective films, etc., for sputtering on electronic equipment, semiconductor chips, solar cells, optical devices and other high-end decorations Supplies etc. If necessary, please feel free to contact us by email.

Boron Round Sputter Target Specifications:

Material

Boron(B)

Technique

Hot isostatic pressing,Grain refinement,Sintering,Forging,Annealing

Purity

99.5%,99.9%, 99.99%

Diameter

≤480mm

Thickness

≥ 1mm

Density

2.34g/cm3

Melting Point

2300 °C

Shape

Discs, Plates, Column Targets, Step Targets, Custom-made

Surface

Polished,Alkali Cleaning,Grinding,Black Oxide, etc.

Certification

ISO9001

Boron Round Sputter Target Pictures:

Boron B Sputtering Targets

Boron Sputter Targets

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