A wafer substrate is the basic material of semiconductor chips. Its purity and lattice structure directly affect the electrical and thermal properties of the chip. Because molybdenum has a high melting point and a good thermal expansion coefficient, it can withstand stress and deformation in high-temperature preparation environments, helping to ensure reliable production of LED chips and improving the efficiency of light sources. In early December, we safely delivered the completed Molybdenum Metal Wafer to customers in Singapore via international express. During the communication process, both of us had a detailed discussion on the size specifications and production processes required by the customer. We basically met the customer's ordering requirements and finally stipulated a delivery deadline. If you are looking for molybdenum wafers for semiconductor, LED, or other high-temperature applications, please contact us with your required size, thickness, material, and surface finish.
There are two main production methods for Polished Molybdenum Wafers: one is powder metallurgy, and the other is cold rolling or hot rolling. Powder metallurgy involves mixing molybdenum powder with other alloying elements and then pressing it to form wafers. The cold rolling method is to roll the molybdenum plate blank at high temperature and high pressure, and then perform annealing and alkali cleaning to obtain thin molybdenum sheets. Moly Wafer is an indispensable substrate material for the production of silicon rectifier complete equipment, semiconductor silicon devices, vacuum tube anodes, and instruments. It has a high melting point, low expansion coefficient, high density, high thermal conductivity, high hardness, low resistivity, and good mechanical properties. With corrosion resistance, good heat dissipation, strong durability, and other characteristics.
