Metal sputtering targets are mainly used in the electronics and information industries, such as integrated circuits, information storage, LCD screens, laser memories, electronic control devices, etc. They can also be widely used in the field of glass coating, wear-resistant tool manufacturing, and high-temperature processing industries. , high-end decorative supplies and other industries. FANMETAL has many years of experience in producing non-ferrous metal products and also has advanced processing equipment. It can provide customers at home and abroad with high-quality and cost-effective metal or alloy target products such as nickel targets, chromium targets, molybdenum targets, tungsten targets, Titanium Aluminum Sputter Targets,etc.
1.Purity
For all metals, purity is one of the main performance indicators of the target material. The purity of the target material has a great influence on the performance of the film. However, depending on the actual application equipment, the purity requirements for the target material are also different. For example, high-purity coating targets are required in high-precision electronic equipment.
2. Impurity content
After a series of target processes, impurities in the target solid and oxygen and water vapor in the pores are the main sources of pollution for deposited films. Because their uses are different, targets for different uses also have different requirements for different impurity contents. For example, the current pure aluminum and aluminum alloy targets used in semiconductors have special requirements for alkali metal content and radioactive element content.
3.Density
In the target technology process, in order to reduce the pores in the target solid and improve the performance of the sputtered film, it is generally required that the target material must have a higher density. Because the target's main characteristic density has a great impact on the sputtering rate, and affects the electrical and optical properties of the film. The higher the target density, the better the performance of the film.
4. Grain size and grain size distribution
Usually the target material has a polycrystalline structure, and the grain size can range from microns to millimeters. For the same target material, the sputtering rate of a target with fine grains is faster than that of a target with coarse grains; while a target with a smaller grain size difference (uniform distribution) will have a more uniform thickness distribution of the film deposited by sputtering .
