Copper Backing Plates

Copper Backing Plates Description

Sputtering is one of the main technologies for preparing thin film materials, and the base plate is a key component in the sputtering process, providing support for the sputtering target and fixing it on the sputtering device, and also dissipating the heat generated during the sputtering process. role. These plates are usually made of copper, copper alloy, stainless steel, molybdenum or tungsten. Copper Backing Plates has high electrical conductivity, excellent thermal conductivity and heat dissipation performance, best mechanical stability, good processing performance, good mechanical strength, high temperature resistance, easy welding, durability and other excellent properties, which can try to avoid the impact of overheating problems to stable and high-speed operation of the sputtering process. Copper Backing Plates are most commonly used in the field of thin film sputter deposition for the production of semiconductors, display devices, sensors and other circuit devices.

Copper Backing Plates Specification:

Copper Backing Plates Pictures:

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