Magnetron sputtering coating is a new type of physical vapor coating method, which uses an electron gun system to emit and focus electrons on the material to be coated, so that the sputtered atoms follow the principle of momentum conversion, so that the material has higher mechanical properties. The material to be plated is called a sputtering target, which mainly includes metals, alloys and ceramic compounds.FANMETAL can provide customers with high-quality metal targets such as Pure Chromium Sputtering Target, Gold Sputtering Target, Titanium Aluminum Sputtering Target and Copper Sputtering Target. Please send us an email to tell us your needs.
1. Purity
Purity is one of the main performance indicators of the target, because the purity of the target has a great influence on the performance of the film. However, in practical applications, the purity requirements of the target are also different. For example, with the rapid development of the microelectronics industry, the size of silicon wafers has grown from 6", 8" to 12", and the wiring width has been reduced from 0.5um to 0.25um, 0.18um or even 0.13um. The previous target purity was 99.995% It can meet the process requirements of 0.35um IC, while the preparation of 0.18um lines requires 99.999% or even 99.9999% of the target purity.
2. Impurity content
Impurities in the target solid and oxygen and moisture in the pores are the main pollution sources of the deposited film. Target materials for different purposes have different requirements for different impurity contents. For example, pure aluminum and aluminum alloy targets used in the semiconductor industry have special requirements for alkali metal content and radioactive element content.
3. Density
In order to reduce the pores in the target solid and improve the performance of the sputtered film, the target is usually required to have a higher density. The density of the target affects not only the sputtering rate, but also the electrical and optical properties of the film. The higher the target density, the better the performance of the film. In addition, increasing the density and strength of the target makes the target better able to withstand the thermal stress during the sputtering process. Density is also one of the key performance indicators of the target.
4. Grain size and grain size distribution
Usually the target material is a polycrystalline structure, and the grain size can range from microns to millimeters. For the same target material, the sputtering rate of the target with fine grains is faster than that of the target with coarse grains; and the thickness distribution of the film deposited by sputtering with a smaller grain size difference (uniform distribution) is more uniform .
