Titanium Aluminum Sputtering Target
Titanium Aluminum Sputtering Target Description
The sputtering target refers to the raw material used in the sputtering deposition process, which refers to the process of ejecting atoms from the solid target due to the bombardment of the target by high-energy particles, and its main function is to deposit a thin film on the object . Titanium Aluminum Sputtering Target is a very commonly used target, which can be produced by casting method and hot isostatic pressing method. The specific process is: first melt the metal material, then pour it into a mold to form an ingot, and then forge it, Rolled, sintered and polished. Titanium Aluminum Sputtering Targets are generally used for decorative coatings, which can deposit films with good hardness, high brightness, corrosion resistance, oxidation resistance, and good fading resistance. If you need, we can provide Titanium Aluminum Sputtering Targets together with copper substrate plate, you can contact us by email.
Titanium Aluminum Sputtering Target Specifications:
|
Grade |
AlTi 25/75,AlTi 30/70,AlTi 40/60,etc. |
|
Technique |
Hot isostatic pressing,Grain refinement,Sintering,Forging,Annealing |
|
Purity |
99.5-99.9% |
|
Thickness |
3mm-30mm |
|
Length |
10mm-2000mm |
|
Circular Diameter |
50-100mm |
|
Density |
3.95g/cm3 |
|
Type |
Planar sputtering target,Rotary sputtering target |
|
Shape |
Discs,Plates,Column Targets,Step Targets,Custom-made |
|
Surface |
Polishing,Alkali Cleaning,Grinding,Black Oxide, etc. |
|
Certification |
ISO9001,COA,MSDS |
Titanium Aluminum Sputtering Target Pictures:
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