Copper Backing Plate For Sputtering Targets

Copper Backing Plate For Sputtering Targets Description

The target assembly is composed of a composite sputtering performance of the target, and the target by welding combined with the backplane, the current common backplane materials are mainly oxygen-free copper, copper alloy, molybdenum and stainless steel tube and other materials. The use of Copper Backing Plate For Sputtering Targets can help the target assembly avoid deformation and cracking under hot conditions, ensure the stability of the film quality and the processing efficiency and service life of the target. Copper Backing Plate For Sputtering Targets is often installed by brazing process, with good electrical and thermal conductivity, easy processing, high mechanical strength, excellent high temperature resistance, wear resistance, arc erosion resistance, long service life, low cost. Copper Backing Plate For Sputtering Targets is a key component of vacuum coating industry or magnetron sputtering technology, which can be used to coat products such as semiconductor devices, electronic equipment and processing tools.

Copper Backing Plate For Sputtering Targets Specifications:

Copper Backing Plate For Sputtering Targets Picture:

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