Copper Target Back Plate

Copper Target Back Plate Description

The target is mainly composed of two parts: "target blank" and "back plate". The back plate mainly plays the role of fixing the sputtering target. Copper Target Back Plate is generally made by the welding process and has a series of excellent properties such as easy processing, high purity, excellent electrical and thermal conductivity, high mechanical strength, high temperature resistance, reusability, and low cost. The main purpose of installing the Copper Target Back Plate is to provide stable support for the sputtering target, facilitate cooling and heat dissipation of the target and target components, ensure the uniformity and consistency of the sputtered film, and improve sputtering efficiency and target use life.

Copper Target Back Plate is most commonly used in the production of semiconductor and display devices and is a key component in the vacuum coating industry or magnetron sputtering technology. Our company can also provide other backsheet materials, such as tungsten and molybdenum. If necessary, please feel free to contact us by email.

Copper Target Back Plates Specifications:

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