99.5% Boron Sputtering Targets
99.5% Boron Sputtering Targets Description
The coating target is a sputtering source that forms various functional films on the substrate by sputtering under appropriate process conditions through magnetron sputtering, multi-arc ion plating or other types of coating systems. 99.5% Boron Sputtering Targets are commonly used for functional coating of electronic equipment, semiconductors and flat panel displays. They have various excellent properties such as high purity, high hardness, corrosion resistance, high temperature resistance, oxidation resistance, wear resistance, electronic impact resistance, and high coating quality. characteristic. 99.5% Boron Sputtering Targets are made of boride materials through powder metallurgy (pressing metal powder under high temperature and pressure) or vacuum arc melting (melting by arc heating in a vacuum chamber and then solidifying on the target) It can be used to prepare hard coatings for cutting tools or functional films for electronic devices. If necessary, we can accept customized requirements, please feel free to contact us by email.
99.5% Boron Sputtering Targets Specifications:
|
Material |
Boron(B) |
|
Technique |
Hot isostatic pressing,Grain refinement,Sintering,Forging,Annealing |
|
Diameter |
≤480mm |
|
Thickness |
≥ 1mm |
|
Density |
2.34g/cm3 |
|
Melting Point |
2300 °C |
|
Shape |
Discs, Plates, Column Targets, Step Targets, Custom-made |
|
Surface |
Polished,Alkali Cleaning,Grinding,Black Oxide, etc. |
|
Certification |
ISO9001 |
99.5% Boron Sputtering Targets Pictures:


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