Polished Molybdenum Wafers
Polished Molybdenum Wafers Description
Wafer substrate is the basic material of semiconductor chips. Its purity and lattice structure directly affect the electrical and thermal properties of the chip. Since molybdenum has a high melting point and good thermal expansion coefficient, Polished Molybdenum Wafers can withstand stress deformation in high-temperature preparation environments, helping to ensure reliable production of LED chips and improving the efficiency of light sources. Secondly, molybdenum also has good mechanical properties, thermal conductivity and corrosion resistance, so Polished Molybdenum Wafers can dissipate heat, resist high temperatures, and ensure the long-term stable operation of electronic devices. The Polished Molybdenum Wafers provided by our company are generally made by powder metallurgy or repeated rolling processes, and have the advantages of high quality, affordable price, short delivery time, and accepting customized services. If you are interested in molybdenum metal products, please send an email contact us.
Polished Molybdenum Wafers Specification:
|
Material |
Molybdenum |
|
Technique |
Rolling,Sintering,Vacuum Annealing,Machining |
|
Purity |
≥99.95% |
|
Diameter |
30mm-200mm |
|
Thickness |
0.05mm-2mm |
|
Delivery Time |
About 25 days |
|
Standard |
ASTM,GB |
|
Certification |
ISO 9001 |
Polished Molybdenum Wafers Picture:


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