Molybdenum Metal Wafer

Molybdenum Metal Wafer Features & Application

Molybdenum Metal Wafer is an indispensable substrate material for the production of silicon rectifier complete sets of equipment, semiconductor silicon devices, vacuum tube anodes and instruments, such as anode support material, power transistor heat shield, silicon rectifier substrate and heat sink, power semiconductor heat compensation sheet. Molybdenum Metal Wafer is a round wafer made of molybdenum material after powder metallurgy or cold rolling processing, with the following excellent characteristics:
1. High melting point (2620℃), high density (10.2g/cm³), high hardness and high tensile strength
2. Similar to the thermal expansion coefficient of monocrystalline silicon, high electrical and thermal conductivity, reducing the semiconductor structural defects that may occur in the hot bonding process
3. Good chemical stability (not easy to react with acid and base), high temperature creep resistance, oxidation resistance, corrosion resistance
4. Good surface finish, good processing performance, high purity and durable wear

Molybdenum Metal Wafer Specification:

Molybdenum Metal Wafer Picture：

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