Moly Wafer

Moly Wafer Description

Moly Wafer has the characteristics of high melting point, low expansion coefficient, high density, high thermal conductivity, high hardness, low resistivity, good mechanical properties and corrosion resistance, good heat dissipation, strong durability, etc., and is often used in semiconductors. And in the LED industry, replace the sapphire substrate as the heat sink, which not only ensures the best heat dissipation of the LED chip, but also improves the working efficiency and service life of the chip.

There are two main production methods of Moly Wafer, one is powder metallurgy, and the other is cold rolling or hot rolling. In powder metallurgy, molybdenum powder is mixed with other alloying elements and pressed into wafers. The cold rolling method is to roll the molybdenum plate rough under high temperature and high pressure, and then perform annealing and alkali cleaning to obtain thin molybdenum sheets.

Moly Wafer Specification:

Moly Wafer Picture:

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