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Copper Tungsten Plate
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Copper Tungsten Plate

Copper Tungsten Plate

Copper Tungsten Plate Features: Copper-tungsten alloy is a metal sweating material composed of two-phase monomers composed of tungsten and copper that are uniformly mixed. It occupies an important position in high-temperature industry, electronic field and aerospace industry. Copper Tungsten...
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Product Details ofCopper Tungsten Plate

Copper Tungsten Plate Features:

Copper-tungsten alloy is a metal sweating material composed of two-phase monomers composed of tungsten and copper that are uniformly mixed. It occupies an important position in high-temperature industry, electronic field and aerospace industry. Copper Tungsten Plate combines the advantages of copper and tungsten, such as high temperature resistance, high strength, strong conductivity, high melting point, anti-adhesion, arc ablation resistance, strong wear resistance, good cooling effect, long service life, etc. , is the first choice material for making electrical contact materials, electrode materials and high temperature resistant components. Our company can provide tungsten copper alloy products of various models and sizes. Welcome to send us an email to tell us your ordering requirements.

Copper Tungsten Plate Application:

1. High-efficiency materials for aerospace: engines, nozzles, gas steering gear and other high-temperature and high-pressure components
2. Resistance welding electrode material: It plays a role in improving processing accuracy and production efficiency in various welding processes
3. High temperature mold material: can replace cast iron mold, suitable for complex surface workpiece processing, extend the service life of the mold
4. The electrical contact material of the high voltage switch: it can ensure the stability, reliability and long life of the switch performance as far as possible
5. Manufacturing semiconductor devices: the material has the characteristics of high thermal conductivity and high thermal diffusion coefficient, which can effectively reduce the operating temperature of the device and improve work efficiency and stability

Copper Tungsten Plate Specification:

Material

CuW50,CuW60,CuW70,CuW80,CuW90

Technique

Extruding,Forging,Rolling,Sintering,Hot Isostatic Pressure,Machining

Purity

Cu:10%-50%

Thickness

10-50mm

Width

5mm-300mm

Length

<2000mm

Density

14.75g/cm3

Surface

Polished,Grinding

Delivery Time

25 days

Standard

GB/T3875.ASTM B760

Certification

ISO9001:2008

Copper Tungsten Plate Picture:

Tungsten Copper Electrode Plate

Tungsten Copper Foil Sheet

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