0.1mm Tungsten Copper Foils
0.1mm Tungsten Copper Foils Description
Tungsten has a high melting point, high density, low expansion coefficient and high strength, and copper has good electrical and thermal conductivity, so the tungsten copper composite material composed of tungsten and copper has all the excellent characteristics of the two metal elements, and can be adjusted by changing the proportion of the composition, control the mechanical properties of the alloy to meet the actual application conditions. 0.1mm Tungsten Copper Foils after mature pressing, sintering and penetration technology, with light weight, good ductility, strong arc ablation resistance, excellent electrical and thermal conductivity, smooth surface without defects, low thermal expansion coefficient, high voltage resistance and other features. 0.1mm Tungsten Copper Foils can be widely used in electrical appliance industry, semiconductor and integrated circuit industry, aerospace, sports equipment, metallurgical processing, mechanical manufacturing and medical fields.
0.1mm Tungsten Copper Foils Specifications:
|
Grade |
WCu50,WCu30,WCu25 |
|
Technique |
Rolling,Sintering,Forging,Annealing,Cutting,Machining, |
|
Thickness |
0.1mm |
|
Width |
10mm-300mm |
|
Density |
11.6g/cm3 |
|
Electric Conductivity |
27-54% |
|
Shape |
Rectangle |
|
Surface |
Polishing,Alkali Cleaning,Grinding,Ground,Black Oxide, etc. |
|
Standard |
ASTM B702,GB |
|
Certification |
ISO9001 |
0.1mm Tungsten Copper Foils Pictures:


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