Titanium Ti Sputtering Target
Titanium Ti Sputtering Target Description
In recent years, with the rapid development of my country's integrated circuit, flat panel display, solar energy and other industries, the demand for metal targets used in the sputtering process has risen rapidly, and Titanium Ti Sputtering Target is a very important functional film in the field of electronic information Material. Titanium has good corrosion resistance and adhesion, so Titanium Ti Sputtering Target is often used for sputtering deposition of pure titanium film or reactive sputtering deposition of TiN film, mainly used as a diffusion barrier layer interconnected with aluminum, and interconnected with copper A hard mask layer, a cap layer to protect the nickel-platinum compound film layer, and an anti-reflection layer. The Titanium Ti Sputtering Target provided by our company has high purity, among which 99.95%, 99.99% and 99.995% high-purity targets can be produced, and have also passed strict quality inspections, so you can order our products with confidence.
Titanium Ti Sputtering Target Specifications:
|
Grade |
Grade 1-4 |
|
Technique |
Sintering,Forging,Annealing,Rolling,Vacuum Melting,Machining |
|
Purity |
99.9%-99.995% |
|
Diameter |
<350mm |
|
Thickness |
1-100mm |
|
Size |
Rectangle (Length 1800mm, Width 400mm Thickness>1mm) Tube ( Rotory Target, OD:20mm-160mm, Thickness:2-20mm) |
|
Density |
4.54g/cm3 |
|
Surface |
Polishing,Bright,Chemical Cleaning,Black Oxide,etc. |
|
Shape |
Disc,Plate,Rectangular,Square |
|
Standard |
ASTM B385,GB |
|
Certification |
ISO9001 |
Titanium Ti Sputtering Target Pictures:
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