High Purity 4N Nickel Sputter Target
High Purity 4N Nickel Sputter Target Description
High Purity 4N Nickel Sputter Target is made of high-purity nickel material after powder metallurgy and forging polishing. It can be prepared by sputtering, electron beam evaporation, chemical vapor deposition or magnetron sputtering. Nickel films with good purity, uniformity and strong conductivity are used in semiconductor manufacturing and integrated circuits. High Purity 4N Nickel Sputter Target has excellent properties such as high strength and hardness, high melting point, good ductility, high surface finish, corrosion resistance, impact resistance, high electrical and thermal conductivity, wear resistance, magnetic stability, etc. It can also be used in aerospace , decoration industry, chemical price, energy industry, automobile manufacturing and metallurgical processing tools and other fields to sputter the wear-resistant, anti-corrosion, high-temperature-resistant metal films required.
High Purity 4N Nickel Sputter Target Specifications:
|
Grade |
4N |
|
Technique |
Hot isostatic pressing,Sintering,Forging,Annealing |
|
Purity |
99.99% |
|
Thickness |
3mm-20mm |
|
Diameter |
10-400mm |
|
Melting point |
1453°C |
|
Density |
8.91g/cm3 |
|
Shape |
Discs |
|
Surface |
Polishing,Alkali Cleaning,Grinding,Black Oxide |
|
Certification |
ISO9001 |
High Purity 4N Nickel Sputter Target Pictures


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