Copper Sputtering Target
Copper Sputtering Target Description & Application
Sputtering targets are a special class of materials that are mainly used in the thin film coating and vacuum coating industries. Copper Sputtering Target is a product of high-purity copper metal processed by a series of processes (such as extrusion, drawing, heat treatment and machining, etc.), and has many excellent properties, such as high purity, low price, electrical and thermal conductivity Strong, high production efficiency and long service life. Copper Sputtering Target can be divided into flat copper sputtering target (round or square) and rotating copper sputtering target (usually tubular), and the size standard is determined according to actual application or customer requirements. Copper Sputtering Targets is the preferred sputtering material, suitable for DC bipolar sputtering, tripolar sputtering, quadrupole sputtering, ion beam sputtering or magnetron sputtering, etc., and can be used to coat reflective films, conductive films , semiconductor films, decorative films, integrated circuits and displays, etc.
Copper Sputtering Target Specifications:
Material | Copper |
Purity | 99.95% |
Size | Φ60 x 16mm |
Density | 8.9g/cm3 |
Melting Point | 1083 °C |
Surface | Polished,Rolled,Cleaned,Machined,Ground,Alkali Wash |
Delivery Time | 15-20 days |
Standard | ASTM,GB,ANSI |
Certification | ISO9001 |
Copper Sputtering Target Pictures:


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