Tungsten Round Sputtering Target
Tungsten Round Sputtering Target Description & Application
The target is one of the indispensable materials for magnetron sputtering technology, and the performance of the target more or less determines the performance and quality of the deposited film. Tungsten Round Sputtering Target has the highest melting point among all metal elements, and has the advantages of high density, high purity, uniform internal structure, good high temperature stability, strong resistance to electron migration, strong corrosion resistance and long service life. Tungsten Round Sputtering Target is generally produced by vacuum melting and hot pressing, followed by rolling, cutting and annealing. It is most commonly used in the electronics industry and solar energy industry. Tungsten Round Sputtering Targets produced by our company can also be used in plasma sputtering, aerospace, petrochemical, semiconductor glass coating, construction and optical information storage space industries.
Tungsten Round Sputtering Target Specifications:
Material | Tungsten |
Purity | 99.99-99.999% |
Size | Φ1mm-300mm |
Thickness | 10mm-450mm |
Density | 19.35g/cm3 |
Melting Point | 3410 °C |
Surface | Milling,Grinding,Black,Bright Polished |
Delivery Time | 15-20 days |
Standard | ASTM B760-86,GB 3875-83,ANSI |
Certification | ISO9001 |
Tungsten Round Sputtering Target Pictures:


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