Moly Copper Foil

Moly Copper Foil Description

Molybdenum copper alloy is a kind of alloy material synthesized by molybdenum and copper two metal materials, which has strong wear resistance and corrosion resistance, so it is widely used in various fields. Moly Copper Foil has the characteristics of high strength, high specific gravity, high temperature resistance, arc ablation resistance, good arc breaking performance, low linear expansion coefficient, good processing performance, strong electromagnetic shielding performance, etc., which is suitable for manufacturing military high-power microelectronic devices as heat sink sealing materials.

Application of Moly Copper Foil:

1. Electronic and electrical fields. Due to the excellent electrical conductivity of the copper element in the alloy, it is very suitable for use as a conductive circuit substrate for the manufacture of electronic equipment, communication equipment, computers and other electronic products.
2. High-temperature processing industry. They can be used as heat conduction materials, often used in radiators, heat conduction plates, chip heat dissipation and other fields to effectively conduct and dissipate heat.
3. It can be used to prepare electromagnetic shielding materials to block or reduce interference of electromagnetic waves, so it can be widely used in electronic equipment, electromagnetic shielding room, communication system and medical equipment and other fields.
4. The softness and corrosion resistance of Moly Copper Foil make it an ideal packaging material that provides good shielding and protection properties and can be used in food packaging, pharmaceutical packaging, electronic component packaging, etc.

Moly Copper Foil Specifications:

Moly Copper Foil Pictures:

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