Aluminum Silicon Sputtering Target

Aluminum Silicon Sputtering Target

Description:

Aluminum silicon alloy is a forging alloy mainly composed of aluminum and silicon, and it is also a material with a low expansion coefficient. The production methods of aluminum silicon sputtering targets include hot isostatic pressing (a process of powder metallurgy), vacuum melting and rolling, special pressure sintering process and forging, of which the most commonly used is hot isostatic pressing.Our company uses high-purity aluminum powder and silicon powder for mixing. After high temperature and high pressure, forging and rolling, target products of various shapes are obtained.Aluminum silicon sputtering targets have the advantages of light weight, high purity and hardness, fine and uniform grains, smooth and defect-free surface, strong toughness, good thermal conductivity, good ductility (can be used as a deformed alloy) and long service life.

Application:

Aluminum silicon sputtering target is a low-cost and widely used Al-Si alloy material, which is mainly used to make Al-Si coating films. We can place the aluminum silicon sputtering target on the electrode in the sputtering chamber and spray it with heavy ion particles or laser to form a thin and dense aluminum-silicon film on the surface of the substrate.Aluminum silicon sputtering targets can be widely used in aerospace, automotive, microelectronics, large-scale integrated circuits, flat panel display industry, optical industry, industrial mold coating, decorative coating, solar cell thin film and large-area coating industry and other fields.

Aluminum Silicon Sputtering Target Specifications:

Aluminum Silicon Sputtering Target Pictures:

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