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High Pure 99.99% Tungsten Titanium W90ti10 Sputtering Target

High Pure 99.99% Tungsten Titanium W90ti10 Sputtering Target

FANMETAL supply the W-Ti alloy tungsten aluminum sputtering target used in PVD coating system in the field of semiconductor . Ti content 10%~50% , normally we supply the WTi 90:10 composition . We also provide other metals target and evaporation material to high purity 99.9999%, precious metal target (Au , Ag , Pt) , target bonding service , crucible liners ( copper , molybdenum , tungsten etc )
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Product Details of High Pure 99.99% Tungsten Titanium W90ti10 Sputtering Target

Product Introduction

With the rapid growth of our business, the requirements of our customers for our Beryllium, Zirconium Round Rod, Tungsten Copper Plate have also increased, so the spirit of being responsible for our customers has been essential. We always adhere to the strategic development of promoting production with science and technology, creating brand with quality, and creating market with brand, and realize scientific modern management. We adhere to the principles of excellent quality, excellent service and good reputation. We consistently adhere to the purpose of "returning users with ingenuity". With high quality and attractive prices, our customers are all over the country and region. We invite you to visit our company for a personalized tour and advanced business guidance.

Tungsten Titanium Sputtering Target

FANMETAL supply the W-Ti alloy tungsten aluminum sputtering target used in PVD coating system in the field of semiconductor . Ti content 10%~50% , normally we supply the WTi 90:10 composition . We also provide other metals target and evaporation material to high purity 99.9999%, precious metal target (Au , Ag , Pt) , target bonding service , crucible liners ( copper , molybdenum , tungsten etc )


Tungsten Titanium Sputtering Target Process:

HP hot press sintering, high pressure and high temperature insulation, produce good density tungsten titanium alloy. Density reaches over 99.5%, precision machining, good density, good purity, and good surface finish.

The main reason why the semiconductor chip to choose new target tungsten titanium alloy barrier layer and as a diffusion bonding layer is the alloy having good surface adhesion ability and excellent heat dissipation characteristics. In this way, the prepared product will have a higher comprehensive performance.


Tungsten Titanium Sputtering Target Description:

Tungsten Titanium Sputtering Target is an alloy that has the advantages of transition metals tungsten and titanium. It has higher density and purity, better corrosion resistance, and smaller volume expansion effects, which can effectively reduce the number of changes in the manufacturing process. The formation of medium particles can successfully prepare high-quality films.

Tungsten titanium alloy materials are produced by hot pressing (HP) or hot isostatic pressing (HIP).They contain all the advantages of tungsten and titanium,such as high strength,low resistivity,low elastic modulus,excellent corrosion and oxidation resistance, good thermal stability,low electron mobility,etc.Tungsten titanium sputtering targets produced by FANMETAL have the characteristics of high purity,high hardness,stable performance,strong operability,smooth surface and attractive metallic luster.

Tungsten Titanium Sputtering Target Application:

Tungsten titanium sputtering targets are widely used in the electronic communication industry,coating processing industry and coating industry,such as semiconductors, displays,optical discs, clocks,automotive glass and architectural glass,optical communications and other fields.High-purity tungsten titanium sputtering targets generally use magnetron sputtering to prepare various thin-film materials,which can be used as gate,connection and barrier materials in the electronics industry,as well as decorative layers for notebook computers and resistance layer in ultra-large-scale integrated circuits. Tungsten titanium sputtering targets, as an ideal thin film material with excellent performance,have good market prospects and economic benefits.


Tungsten Titanium Sputtering Target Specifications:

Grade

WTi10,WTi90

Material

tungsten and titanium

Purity

99.9%-99.95%

Technique

High Temperature Insostatic Pressing,Cold Rolled, Hot Rolled,

Diameter

≤400mm

Thickness

50mm,60mm,80mm,100mm

Density

19.3g/cm3 and 4.51g/cm3

Shape

Disc,Rectangle,Plate,Sheet,Round,Square

Surface

polish,bright,checkered,blast,etching

Standard

ASTM B381,ASTM B348,GB/T,DIN

Certification

ISO 9001,SGS,COA


Tungsten Titanium Sputtering Target Pictures:

image001


We believe that providing proven, efficient, simple and practical High Pure 99.99% Tungsten Titanium W90ti10 Sputtering Target is the prerequisite for creating new value. We know that quality and service are the foundation of enterprise survival, we will always uphold: customer first, the pursuit of excellence. Our company has continuously increased R & D investment and technological innovation, and the upgrading of products and the internal and external quality of products have been continuously improved.

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