Ion Implantation Parts in Molybdenum And Tungsten for Semiconductor

The Ion Implantation Parts in Molybdenum And Tungsten is a key device in the manufacture of integrated circuits. When the ion beam is injected into the semiconductor surface and deposited, the carrier concentration and conductivity type change.

Ion implantation is widely used in semiconductor materials, metals, ceramics, polymers and other fields due to its excellent surface modification. Ion implantation is the key to the manufacture of large scale integrated circuits (ICs). Molybdenum devices are the key devices for suppressing and shielding ionizing rays in the ion source system of semiconductor ion implanters.

Since the conversion of the ion source to plasma ions during the ion implantation produces a working temperature of over 2000°C, and the ion beam ejection also generates a large amount of ion kinetic energy, typical metals are rapidly burned and melted.

Application: Parts of molybdenum ion implanter for semiconductor

1. Most of the molybdenum parts used for ion implantation are used in the semiconductor industry;

2. Produce molybdenum ion implantation devices with high density, high purity, high precision and uniform internal structure;

3. Our molybdenum ion implantation parts are suitable for medium beam injector and strong beam injector;

4. Molybdenum parts for ion implantation are produced according to customer drawings.

5. Suitable for metallurgy, rare earth, machinery and other industries

Ion Implantation Parts in Molybdenum And Tungsten Picture：

 Are you a factory or a trading company?

We are the manufacturer.

How long is your delivery time?

3-5 days in stock, if not, 15-30 days

Can you give me a sample?

Yes, we provide samples for free, you only need to bear the shipping and bank charges.

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